MPU-9250 QFN-24 9-axis Inertial Measurement Units IC consisting of two dies integrated into a single QFN package. One die houses the 3-Axis gyroscope and the 3-Axis Accelerometer. Hence, the MPU-9250 is a 9-axis motion tracking a device that combines a 3-axis gyroscope, 3-axis accelerometer, 3-axis magnetometer and a Digital Motion Processor (DMP) all in a small 3x3x1mm package available as a pin-compatible upgrade from the MPU6515. With its dedicated I2C sensor bus, the MPU-9250 directly provides complete 9-axis MotionFusion output. The MPU-9250 MotionTracking device, with its 9-axis integration, on-chip MotionFusion™, and runtime calibration firmware, enables manufacturers to eliminate the costly and complex selection, qualification, and system level integration of discrete devices, guaranteeing optimal motion performance for consumers.
MPU-9250 is also designed to interface with multiple non-inertial digital sensors, such as pressure sensors, on its auxiliary I 2C port. MPU-9250 features three 16-bit analogue-to-digital converters (ADCs) for digitizing the gyroscope outputs, three 16-bit ADC for digitizing the accelerometer outputs, and three 16-bit ADC for digitizing the magnetometer outputs. For precision tracking of both fast and slow motions, the parts feature a user-programmable gyroscope full-scale range of ±250, ±500, ±1000, and ±2000°/sec (dps), a user-programmable accelerometer full-scale range of ±2g, ±4g, ±8g, and ±16g, and a magnetometer full-scale range of ±4800µT. Other industry-leading features include programmable digital filters, a precision clock with 1% drift from -40°C to 85°C, an embedded temperature sensor, and programmable interrupts. The device features I 2C and SPI serial interfaces, a VDD operating range of 2.4V to 3.6V, and a separate digital I/O supply, VDDIO from 1.71V
Communication with all registers of the device is performed using either I2C at 400kHz or SPI at 1MHz. For applications requiring faster communications, the sensor and interrupt registers may be read using SPI at 20MHz.
By leveraging its patented and volume-proven CMOS-MEMS fabrication platform, which integrates MEMS wafers with companion CMOS electronics through wafer-level bonding, InvenSense has driven the package size down to a footprint and thickness of 3x3x1mm, to provide a very small yet high-performance low-cost package. The device provides high robustness by supporting 10,000g shock reliability.